About TylSemi, Inc.
The Opportunity
The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem: how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package?
That's what we solve. TylSemi builds the chiplet infrastructure IP — the IO, power delivery, and interconnect building blocks — that makes AI/HPC systems actually work at scale.
This isn't a nice-to-have. It's the critical path.
Why NowThe Market Window
The semiconductor industry is going through its biggest architectural shift in 40 years:
• Moore's Law is dead. 2nm and beyond delivers marginal performance gains. The future is chiplets, not monolithic dies.
• Custom silicon is now mainstream. Google, Microsoft, Amazon, Meta, OpenAI — they're all designing their own ASICs. The $50B custom silicon market is growing 30% annually.
• IO and power are the bottleneck. Solve hard problems and provide something which is a category in itself.
Translation: We're entering the market at exactly the moment when every major AI/HPC player needs what we're building, and their alternatives are disappearing.
Culture & Team: How We WorkNo Politics, No Bureaucracy
There are no layers, no approval chains, no corporate theater.
• If you have an idea, we test it. If it works, we ship it.
• No endless meetings, no PowerPoint presentations to convince middle management.
Remote-Friendly, Global Team
• US team: Bay Area preferred, but we hire the best people regardless of location
• India team: Building a world-class design center in Bangalore
Move Fast, Ship Real Products
We're not a research project. We have paying customers, committed capital, and aggressive timelines.
This is a company, not a lifestyle business. We're building to win.
What We Value
• Ownership mindset. You're not here to execute someone else's roadmap. You're here to define it.
• Bias for action. We move fast. Analysis paralysis doesn't fly here.
• Deep technical expertise. This is hard engineering. We need people who've shipped real silicon and debugged real hardware.
• Low ego, high standards. We don't care about titles or politics. We care about results.
The Ask
If you're reading this, you're probably comfortable. You have a good job at a stable company with all the benefits.
We're asking you to walk away from that and bet on us.
Here's why you should:
• The market is real. AI infrastructure spending is $200B+ annually and growing 40% YoY. Every hyperscaler needs what we're building.
• The team has done this before. We've built and exited semiconductor companies at scale. This isn't our first rodeo.
• The traction is de-risked. We have LOIs, strategic investors, and a clear path to revenue.
• The work is consequential. You're not optimizing someone's ad click-through rate. You're building the silicon infrastructure that powers AI.
This is the bet. Join us and build something that matters.
Or stay comfortable. No judgment.
But if you're the kind of person who wants to take the shot, we'd love to talk.
READY TO JOIN?
Role Overview
We are seeking a highly experienced Design Verification Architect to lead the definition and execution of scalable, reusable, and high-quality verification strategies for next-generation SoCs targeting AI, HPC, and Networking applications. This role requires deep expertise in verifying large and complex SoCs and a passion for building next-gen verification platforms, leveraging automation, portability, and AI-driven methodologies.
What You’ll Do
Define and drive the
overall verification architecture for large-scale SoCs, ensuring scalability from
IP → subsystem → full SoC level Architect and develop
reusable, modular, and portable verification platforms that can be leveraged across multiple chip programs Establish methodologies for
seamless reuse and portability, including
Portable Stimulus (PSS)-based verification flows Lead the development of
high-performance, coverage-driven testbenches using industry-standard methodologies (e.g., UVM) Drive
multi-level verification strategies, enabling efficient scaling across: Block-level, Multi-block/subsystem level, Full-chip SoC level Define and enforce
verification quality metrics, coverage closure strategies, and sign-off criteria Champion a
“fail-fast” philosophy to detect issues early and improve overall design quality Drive initiatives toward
first-pass silicon success, minimizing escapes and post-silicon debug effort Leverage
AI/ML techniques and AI agents to: Automate testbench generation Improve stimulus generation and coverage closure Enhance regression efficiency and debug productivity Enable intelligent verification QA and anomaly detection Collaborate closely with
design, architecture, physical design, and software teams to ensure alignment and early issue detection Mentor and guide DV teams on
best practices, methodology adoption, and architectural decisions What We’re Looking For
Bachelor’s/Master’s degree in Electrical Engineering, Computer Engineering, or related field 12+ years of experience in
Design Verification, with significant exposure to
large SoC verification Proven experience in defining and deploying
verification architectures for complex chips Strong expertise in: SystemVerilog and UVM Coverage-driven verification (functional + code coverage) Assertion-based verification (SVA) Hands-on experience with
Portable Stimulus (PSS) and cross-level stimulus reuse Deep understanding of
SoC architectures in AI, HPC, or Networking domains Experience with
multi-IP integration challenges, coherency, high-speed interfaces, and large-scale data movement Strong debugging skills and ability to handle
complex system-level issues Preferred Qualifications
Experience with
AI/ML applications in verification workflows Exposure to
emulation, prototyping, or hybrid verification platforms Familiarity with
performance verification and power-aware verification Knowledge of industry-standard protocols (e.g., PCIe, DDR, Ethernet, CXL, UCIe) Experience building
verification frameworks reused across multiple tape-outs Key Attributes
Strong architectural thinking with a
systems-level mindset High ownership with a
quality-first approach Bias toward
automation, reuse, and scalability Passion for adopting
cutting-edge technologies, especially AI-driven verification Ability to operate in a fast-paced environment with a
fail-fast, learn-fast attitude Excellent collaboration and leadership skills
Success in This Role Looks Like
High degree of
verification reuse across programs Achievement of
coverage and quality goals within schedule Reduction in
verification cycle time through automation and AI Strong track record of
first-time silicon success Minimal post-silicon escapes and debug cycles
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